Using VIA in PAD - Guidelines, Dimensions and More

Learn about the critical aspects of using VIA and VIA-in-PAD in PCB design through this comprehensive video tutorial. Explore minimum size requirements, selection criteria, cost considerations, and essential guidelines for implementing VIAs and VIAs in PAD. Discover insights on dimensions, handling, registration, and Laser Direct Imaging techniques. Understand limitations, air trapping issues, and various filling systems including resin and epoxy. Examine potential problems like eyebrow cracks and learn about alternative solutions such as stacked microvias. Gain valuable knowledge on VIA types, plugging methods, and where to send VIAs for manufacturing. Benefit from expert advice provided by Mike from Exception PCB to optimize your PCB design process.

Introduction
Exception PCB
How it started
The answer from Mike
Dimensions
Handling
Registration
Laser Direct Imaging
Minimum VIA
Minimum Size
Limitations
Via in
Air trapped inside VIA
Resin fill systems
Resin filled VIA
Epoxy filled VIA
Eyebrow crack
Using stacked microvias
Filling vias
Conclusion
Whats next
Where to send VIAs
Dimension of VIAs
VIA Types
Plugging