Using Superpowers for Hardware Reverse Engineering

Explore hardware reverse engineering techniques in this 54-minute conference talk from BSidesLV 2014. Delve into PCB construction and layer stack analysis, learn about laser-based methods for soldermask removal, controlled-depth skiving, and full PCB layer ablation. Discover the applications of acoustic microscopy in examining epoxy encapsulation, and gain insights into X-ray inspection techniques, including both 2D general PCB inspection and 3D/CT PCB layer extraction. Enhance your understanding of advanced hardware analysis methods and their practical applications in reverse engineering.

Using Superpowers for Hardware Reverse Engineering
HW Reverse Engineering
PCB Construction & Layer Stack 2
Laser: Soldermask Removal 2
Laser: Controlled-Depth Skiving 2
Laser: Full PCB Layer Ablation 2
Acoustic Microscopy: Examining Epoxy Encapsulation
X-Ray (2D): General PCB Inspection 4
X-Ray (3D/CT): PCB Layer Extraction