Better Learning Through Specialization - tinyML Summit 2019

Explore DARPA's innovative approaches to machine learning in this 22-minute conference talk from the tinyML Summit 2019. Delve into Bill Chappell's presentation on "Better Learning Through Specialization," where he discusses the Microsystems Technology Office's roadmap for experiential learning, feature recognition, and spectrum collaboration challenges. Discover insights on virtual environments, self-play techniques, and hardware advancements that are shaping the future of specialized machine learning. Gain valuable knowledge about DARPA's efforts in improving trust in AI results and their showcases at events like Mobile World Congress.

Introduction
Roadmap
Experiential Learning
Feature Recognitions
Spectrum Collaboration Challenge
Virtual Coliseum
Mobile World Congress
Trust Results
Self Play
Hardware