Stanford Seminar - Low-Cost 3D Chip Stacking with ThruChip Wireless Connections

The current Stacking methods challenges are its high costs. This seminar from Thruchip discusses the advantages of using Wireless approach for stacking 3D chips.

Wireless stacking allows chips to be stacked at a lower cost, and lower power and provides a higher bandwidth.

Introduction.
Wireless 3D stacking.
3D Stacking with Wire Bonds.
Wire bonding: Pretty example.
Wire bonding: Not so pretty.
3D Stacking with Thru Silicon Vias (TSV).
Proposal for lower cost 3D stacking.
NAND goal is to go.
DRAM goal is to go.
Ultra-Thin 4u wafer breakthrough.
Wireless Near-Field Inductive Coupling.
Communication is via magnetic field.
ThruChip Interface (TCI).
TCI coil example.
TCI bandwidth vs communication distance.
TCI scales with digital CMOS.
Energy per Bit becomes very compelling.
Constant Magnetic Field Scaling.
TCI broadcasting more efficient than TSV.
Crosstalk decays rapidly.
Channel Pitch vs. Crosstalk.
TCI Coils can be overlapped with QPDM.
Compatible with Conventional EDA.
TCI has High Reliability.
Compatible with Conventional Testing.
TCI EM Compatibility.
Misalignment Tolerant.
TCI demonstrated with 28 test chips.
HDSV: A new way to deliver power.
Highly Doped Silicon Vias for power distribution.
TCAD modeling: HDSV resistance.
HDSV Wireless Power Distribution.
Example HBM DRAM with TSV.
Replace TSV signals with TCI coils.
Ultra-Thin Lowest Cost 3D Packaging.
Technical Summary.
Final stack DRAM example.