Electronic Materials, Devices, and Fabrication

Instructor: Prof. S. Parasuraman, Department of Metallurgical and Materials Engineering, IIT Madras.

This course is designed to develop an understanding of the materials, devices, and processing techniques used in the current semiconductor industry. The course provides the students with the basic physics behind semiconductor materials, types of semiconductors, and the reason for the dominance of silicon in the electronics industry. The course also covers the basics of devices with emphasis on their electronic characteristics. Optical devices like LEDs, lasers, solar cells, will also be explained. The current manufacturing processes in the silicon-based semiconductor industry, starting from silicon wafer production to final IC (integrated circuit) development, will be explained.

Electronic Materials.
Worked numericals on week 1 lessons.
Optional - worked assignment on intrinsic semiconductors.
Semiconductors: Introduction.
Junction breakdown and heterojunctions.
Electron statistics in a solid.
Worked assignment on extrinsic semiconductors.
Intrinsic semiconductors.
Optional - worked assignment on metal-semiconductor junctions.
Intrinsic semiconductors - conductivity.
Worked assignment on pn junctions.
Extrinsic semiconductors: Introduction.
Worked assignment on transistors.
Extrinsic semiconductors - Fermi level.
Optional - worked assignment on optical properties.
Extrinsic semiconductors - mobility.
Worked assignment on optoelectronic devices.
Metal-semiconductor junctions.
pn junctions in equilibrium.
pn junctions under bias.
Transistors - overview.
MOSFETs.
Optoelectronic devices: Introduction.
Light emitting diodes.
Solid state semiconductor lasers.
Photodetectors.
Solar cells.
Mod-01 Lec-20 Semiconductor manufacturing: Introduction.
Mod-01 Lec-21 Si wafer manufacturing.
Mod-01 Lec-22 IC device manufacturing: overview.
Mod-01 Lec-23 Layering: thermal oxidation.
Mod-01 Lec-24 Doping: thermal and ion implantation.
Mod-01 Lec-25 Lithography.
Mod-01 Lec-26 Etching and deposition (growth).
Mod-01 Lec-27 Metallization and polishing.
Mod-01 Lec-28 Process and device evaluation.
Mod-01 Lec-29 Productivity and process yield.
Mod-01 Lec-30 Clean room design and contamination control.
Mod-01 Lec-31 Devices and IC formation.
Mod-01 Lec-32 IC circuit logic and packaging.