Chip Decapping on a Budget

Explore the fascinating world of integrated circuit decapping in this 25-minute conference talk from Shmoocon 2020. Discover budget-friendly techniques to reveal the hidden secrets beneath the surface of everyday ICs, circumventing manufacturer obfuscation methods. Learn about wafers, IC packaging, capsulation materials, and bond wires. Delve into mechanical and chemical removal processes, including acid concentration and laser cutting methods. Gain insights from speaker Zach Pahle, an experienced hacking village organizer with diverse interests in robotics, software-defined radios, machining, tamper-evident devices, and hardware hacking.

Intro
Who am I
What is decapping
Wafers
IC Packaging
Capsulation Materials
Bond wires
Mechanical removal
Die depth
Chemical removal
Acid concentration
Laser cutter
Laser particle removal