Tackling Capacity and Density Challenges by Electro-Photonic Integration - Benny P. Mikkelsen - OFC

Explore the critical role of photonic integration and digital signal processing in addressing capacity and density challenges in optical networks. Dive into traffic trends, space and power constraints, and the characteristics of electronic and photonic integration. Learn about different types of electro-photonic integration and follow the journey of a bit through wired networks. Examine coherent technology as an ideal application for electro-photonic integration and compare two material systems for photonic integration. Discover integration achievements in transport, trends in coherent transceivers, and how electro-photonic integration tackles challenges in transport. Investigate future transport trends benefiting from this technology, as well as its applications in campus and data center environments. Understand the penetration of multilevel and coherent technologies into shorter reach applications and explore the journey from switch to front panel. Finally, learn about a 50Tbps switch with co-packaged optics that saves power and space.

Intro
Traffic and Spending Trends
Space and Power Trends
Integration Tackles Capacity, Size, Power and Cost Challenges
Characteristics of Electronic and Photonic Integration
Types of Electro-Photonic Integration
The Journey of a Bit Through the Wired Network
Capacity and Density Challenges, and Trends in Transport
Coherent is the ideal Application of Electro-Photonic Integration
Two Material Systems for Photonic Integration
Integration Achievements in Transport
Trends in Coherent Transceivers
How Electro-Photonic Integrations Tackles Challenges in Transport
Future Transport Trends Benefiting from Electro-Photonic Integration
The Journey on Campus and inside the Data Center (non-DWDM)
Multilevel and Coherent Penetrating Shorter Reach
The Journey from the Switch to the Front Panel
50Tbps Switch with Co-packaged Optics Saves Power and Space