Electronics Enclosures Thermal issues

Electronics Design is understood as analysis and implementation at various levels from large systems installation to chip design. One of the aspects is failure due to temperature effects is constantly under study. Theory of Heat transfer has been understood and explained way back in 1700. Rigor and precision has resulted in seemingly complicated ‘equations’.In the design of enclosures, managing heat is (relatively) well understood. Empirical results can be used to optimise the layout and reduce failure. Practices in use of heat management hardware are available from specialist manufacturers and can be used. This course is an attempt to familiarise the participating registrants with heat related issues in Design of Electronic Product enclosures.INTENDED AUDIENCE:Registrants to BSc, BE, B.Tech, MSc and ME, M.Tech courses,Product design engineers (in related industry)Product ManagersPREREQUISITES :12th StandardINDUSTRY SUPPORT :Electronics and Mechanical involved in enclosure Design

1. Introduction to Enclosures and thermal issues 2. Basics of conductive heat transfer 3. Radiation at normal ambient 4. Convection basics 5. Forced convection 6. Combined modes   7. Use of Conduction in enclosures 8. Radiation as a speciality 9. Convective cooling in small products 10. Forced cooling in medium and large systems 11. Liquid cooled high power modules 12. Novelty phase change and thermo electrics 13. Refrigerated cabinets   14. Heat sinks practical application 15. Blowers, fans, ventilations of systems 16. Instrumentation for measurement 17. Effects on sealed enclosures   18. Integration of ID with the heat aspects 19. Case stories in biological instruments 20. Case study of select participants’ work 21. Application of Thermal CAD and round up